2013

MSM

Technology

Chip Size

Power Supply

Function

Key Accelerators

Power Consumption

Released Date

0.13 μm 1P8M CMOS Process

2.35 mm x 5.0 mm

3.3V(IO), 0.7-1.0V(Core)

EEG Signal Processing, Transcranial Electrical Stimulation

Independent Component Analysis (ICA), Fast Fourier Transform (FFT),

Support Vector Machine (SVM)

4.45mW

Aug. 2013

2013

Gluco Scope2

Technology

Chip Size

Power Supply

Function

Key Block

Power Consumption

Released Date

0.18um 1P6M CMOS Process

2.5 mm x 5.0 mm (including pads)

1.5V

Non-invasive Blood Glucose Level Estimation

Impedance Spectroscopy Circuit,

Multi-wavelength Near-infrared Spectroscopy Circuit

Maximum 38mW

Aug. 2013

2013

Biocle5

Technology

Chip Size

Power Supply

Function

Modulation

Channel Frequency

Sensitivity

Power Consumption

Released Date

0.13 μm CMOS Technology

2.5 mm x 5.0 mm

1.2 V

Human Body Communication (HBC) Network Coordinator

Frequency Selective Digital Transmission (FSDT)

21 MHz (5.25 MHz Bandwidth)

-98 dBm @ 124 kbps

33 μW/nodes

Aug. 2013

2013

SEIT

Technology

Chip Size

Power supply

Function

Sensitivity

Injectable Current

THD

Power Consumption

Released Date

0.18 μm 1P6M CMOS Technology

2.5 mm x 5.0 mm

1.8 V

Electrical Impedance Tomography (EIT)

4.9 mΩ

10-400 μAp-p (0.1-100 kHz)

0.2% @ 200 μAp-p

53.4 mW (USB Supply)

Aug. 2013

2013

BONE-AR

Technology

Chip Size

Function

Frequency(Nominal)

Peak Performance

Power Dissipation

Area Efficiency

Power Efficiency

Per-frame Energy

Released Date

65nm 1P8M CMOS Process

4.0 mm x 8.0 mm

Markerless Augmented Reality

250 MHz (Digital)

1.22 TOPS

381 mW

38.13 GOPS/mm2

1.57 TOPS/W

12.70 mJ/frame

Jun. 2013